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The main materials for ceramic circuit boards are aluminum oxide 96.6%, aluminum oxide 99.9%, aluminum nitride ceramic 96.6%, aluminum nitride ceramic 99.9%, and aluminum oxide circuit board Alumina Al2O3. This type of ceramic circuit board is relatively common, with high cost-effectiveness, good insulation and moderate thermal conductivity, and is widely used in various electronic components.

Aluminum Nitride AlN circuit board, which has excellent thermal conductivity and electrical insulation, is often used in high-power and high-frequency applications, such as high-power electronic components, high thermal conductivity circuit boards, and so on.

In addition, there is also a silicon nitride circuit board called Silicon Nitride SiN, which has good mechanical strength and chemical stability and is suitable for high-performance microwave components and power devices.

In addition, there are composite ceramic circuit boards, which combine two or more ceramic materials together to form a new type of functional material, thereby obtaining properties and functions that a single ceramic material does not possess.

Composite ceramic circuit boards are customized according to specific application requirements, combining the advantages of various ceramic materials and possessing multiple advantages, which can meet the high-performance and high reliability requirements of circuit boards in different fields.

BeO ceramic substrate, which has good thermal conductivity and bending strength, is commonly used in high-performance electronic devices.

There is also Si3N4 ceramic substrate, which also has good mechanical properties and is widely used in the field of electronic packaging.

So how are ceramic circuit boards produced by China Chaosheng produced? It adopts a series of advanced manufacturing processes such as sintering, sputtering, coating, and silver plating to form circuit diagrams for ceramic circuit boards.

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